INTERGEO 2024 in Stuttgart, Germany

The international geo community will meet in Stuttgart and digitally worldwide on the web. Geodata is a fundamental part of the building information modelling (BIM) process and ensures planning and construction work is efficient, digital and sustainable. Building information modelling (BIM) remains a hot topic at this year’s INTERGEO EXPO and CONFERENCE. As in previous years, INTERGEO is addressing this topic in its role as the world’s leading platform for geodesy, geoinformation and land management. 

INTERGEO 2024 is the international platform for experts and decision-makers from the worlds of public administration, science, politics and business who use data, information and solutions from geo-IT sectors to carry out their work digitally, efficiently and sustainably. At the EXPO and CONFERENCE, INTERGEO will be revealing current trends and the latest developments from the geospatial industry, making the event this sector’s number one networking format for exhibitors and visitors from all over the world. 

Amberg Participation

Visit our booth H1.040 in hall 1 and take the opportunity to meet our market representatives and experts from Amberg Technologies. 

We are excited to introduce the brand new Amberg Structural Deformation module, expanding our solutions for segmental lining (TBM) projects. This addition complements our continuously improving Amberg Tunnel office software and Amberg Navigator tablet field solution, ensuring comprehensive support for your tunnelling needs.

Learn more Amberg Clearance. Ensuring adequate clearance is essential for trains to safely pass through tunnels, under bridges, and around other structures without risk of collision. This fundamental aspect of railway safety, efficiency, and longevity is expertly addressed by our advanced Amberg Clearance IMS 5000 system.

For the first time Amberg Infra 7D will attend with an own booth at INTERGEO. Visit us at booth G1.066 in hall 1 and learn more about GEOvis 4.0, the platform for all your GeoMonitoring and IoT projects.

We would be pleased to welcome you.